High vacuum environment

Maintenance process chamber vacuum:

In the semiconductor manufacturing process, many processes such as chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation, etc., need to be carried out in a high vacuum environment to avoid the pollution and influence of impurity gases on semiconductor materials. The vacuum valve can effectively isolate different vacuum areas, prevent air or other gases from entering the process chamber, and ensure a high vacuum inside the chamber, thus ensuring the quality and performance of the semiconductor device.

Reduce the interference of gas molecules:

The high vacuum environment can reduce the scattering and absorption of gas molecules to the particle beam and plasma in the semiconductor manufacturing process, improving the accuracy and repeatability of the process. The precise control of the vacuum valve helps to maintain this stable high vacuum state, making the process more controllable.

High precision gas flow and pressure control requirements

Precise control of process gas flow:

The different process steps of semiconductor manufacturing have strict requirements for gas flow. For example, in the CVD process, precise control of the flow rate of the reaction gas is essential to generate a uniform, high-quality film. The vacuum valve can precisely adjust the flow of gas according to the process requirements to ensure that the reaction is carried out at a predetermined rate, so as to obtain good film growth and electrical properties.

Stable control of the reaction chamber pressure:

pressure changes in the process chamber will affect the growth rate of the semiconductor material, the uniformity of the film and the doping concentration. Through rapid response and precise adjustment, the vacuum valve can keep the pressure in the reaction chamber stable, provide stable process conditions for semiconductor manufacturing, and help improve product consistency and reliability.

High temperature and low temperature environment

High temperature resistance:

In some semiconductor processes, such as diffusion, annealing, etc., need to be carried out in a high temperature environment. At this time, the vacuum valve needs to have good high temperature resistance to ensure that it can still work normally under high temperature conditions and maintain the vacuum degree and gas control function of the system. In general, the material selection and structural design of semiconductor vacuum valves should take into account the requirements of high temperature resistance to adapt to the high temperature environment in the process.

Low temperature resistance:

Some semiconductor manufacturing processes, such as certain etching processes or low temperature physical processes, may require operation in low temperature environments. The vacuum valve should also be able to maintain good sealing performance and mechanical properties under low temperature conditions to prevent problems such as material embrittlement and seal failure caused by low temperature to ensure the normal operation of the system.

Corrosion and pure gas environment

Corrosion resistance:

In semiconductor manufacturing, a variety of corrosive gases are used, such as chlorine and fluorine. When the vacuum valve is in contact with these corrosive gases, it must have excellent corrosion resistance to prevent the valve material from being corroded, thus affecting the sealing and service life of the valve. The key components of the valve are usually made of corrosion-resistant materials, or special anti-corrosion treatment is performed on the valve surface to meet the requirements of the process environment.

Ensure gas purity:

Semiconductor manufacturing requires very high purity of gases, and any small impurities can have a serious impact on the performance of semiconductor devices. In the process of controlling the gas flow, the vacuum valve cannot introduce additional impurities, and its internal sealing materials and surface treatment must be strictly screened and treated to ensure that the gas in contact remains high purity.

High frequency action and reliability require

frequent switching action:

On semiconductor production lines, vacuum valves need to be switched on and off frequently to meet the rapid switching and gas control requirements between different process steps. For example, during wafer transfer, the transmission valve needs to be opened and closed several times in a short period of time to achieve accurate transfer of wafers between different chambers. Therefore, the mechanical structure and drive system of the valve need to have high reliability and durability, and can withstand frequent operations without failure.

Long life and low maintenance requirements:

In order to ensure the continuous and stable operation of semiconductor production lines and reduce production interruptions caused by equipment maintenance, vacuum valves need to have a long service life and low maintenance requirements. This requires that the various components of the valve have good wear resistance, fatigue resistance and stability, while being easy to clean and maintain, and can maintain stable performance over a long period of time.

Low particle generation and clean environment

Avoid particle pollution:

Semiconductor manufacturing requires very high cleanliness of the environment, and any small particles may form defects on the surface of the wafer, affecting the performance and yield of semiconductor devices. In the process of opening and closing the vacuum valve, it is necessary to reduce the production and fall off of particles as much as possible, and its internal structural design and material selection should fully take this into account, using low-friction, low-wear materials and optimized valve action to prevent particle pollution of the process environment.

Adapt to clean room standards:

Semiconductor manufacturing is usually carried out in clean rooms, and vacuum valves, as a key component, need to meet the relevant standards and specifications of clean rooms. This includes requirements for the surface finish of the valve, the low volatility of the material, and the prevention of static electricity to ensure that the valve does not pollute the clean room environment during use.